
Trustes Platform Module (TPM)
» Can be equipped optionally
Super I/O: WINBOND W83627DHG-P LPC Super I/O
» Serial Ports (COM1 and COM2)
» Infrared Device Association (IrDA) 1.0 SIR interface
» Parallel Port (LPT1)
» Enhanced Parallel Port (EPP) and Extended Capabilities Port (ECP) with bi-directional capability
» Floppy (optional): shared with LPT signals
BIOS: AMI, 1 MB Flash BIOS
» BIOS support for external super I/O (COM3, COM4, LPT, and Floppy)
Watchdog timer (WDT)
Real-time clock with CMOS RAM
Standard ACPI Support
3.2 Available Modules ETX®-DC 18bit
18bit and 24 bit oLDI (18 bit + dithering)
ETX-DC extended Temperature E1
18bit and 24 bit oLDI (18 bit + dithering)
3.3 Available Modules ETX®-DC 24bit
ETX-DC with 24 bit VESA mapping
24 bit VESA only (18 bit + dithering)
ETX-DC with 24 bit VESA mapping
extended Temperature E1
24 bit VESA only (18 bit + dithering)
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