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COMe-bPC2 / BIOS Operation
ACPI Cooling Options
Feature Option Description
Passive Trip Point
Disabled
40°C
45°C
50°C
…
110°C
This value controls the temperature of the ACPI Passive
Trip Point - the point in which the OS will begin
throttling the CPU.
Passive TC1 value
1
2
3
…
16
This value sets the TC1 value for the ACPI Passive
Cooling Formula. (Only visible when Passive Trip Point is
enabled.)
Passive TC2 value 1
2
…
5
…
16
This value sets the TC2 value for the ACPI Passive
Cooling Formula. (Only visible when Passive Trip Point is
enabled.)
Passive TSP value 2
4
…
10
…
30
This item sets the TSP value for the ACPI Passive Cooling
Formula. It represents in tenths of a second how often
the OS will read the temperature when Passive Cooling
is Enabled.
Critical Trip Point Disabled
40°C
45°C
50°C
…
110°C
This value controls the temperature of the ACPI Critical
Trip Point - the point in which the OS will shut off the
system.
85
- COMe-bPC2 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- COMe-bPC2 / Introduction 9
- 2.5 COM Express® Benefits 10
- 3 Product Specification 11
- Accessories 12
- 3.2 Functional Specification 13
- GMCH and IOH specifications 14
- Graphics Core 15
- Connectivity 16
- Misc Interfaces and Features 16
- Kontron Features 16
- Power Features 17
- Supported Operating Systems 17
- 3.3 Block Diagram 18
- 3.4 Electrical Specification 19
- 3.4.5 ATX Mode 20
- 3.4.6 Single Supply Mode 20
- 3.5 Power Control 21
- 3.6.2 Humidity 22
- CE marking 23
- WEEE Directive 23
- Conformal Coating 23
- Shock & Vibration 24
- 3.8 MTBF 25
- 3.9 Mechanical Specification 26
- 3.10 Module Dimensions 26
- 3.10.2 38009-XXXX-XX-X 27
- 3.11 Thermal Management 28
- 3.12 Heatspreader 28
- 3.13 Onboard Fan Connector 29
- 4 Features and Interfaces 31
- 4.3 LPC boot 33
- 4.4 M.A.R.S 34
- 4.5 Fast I2C 35
- 4.6 JIDA16 and JIDA32 36
- 4.7 K-Station 1 37
- 4.8.1 I2C 38
- 4.8.2 Storage 38
- 4.8.3 GPIO 38
- 4.8.4 Hardware Monitor 38
- Configuration 39
- 4.10 Watchdog Timer 40
- 4.11 Flash Backup Feature 41
- 4.12 Speedstep Technology 43
- 4.13 C-States 44
- 4.15 VID-x 46
- 4.20 Display Configurations 50
- DDI Design Consideration 51
- Requirements 52
- Setup a Multi-monitor system 52
- 4.22 Intel® vPro™ technology 54
- 5 System Ressources 56
- 5.1.2 In APIC mode 57
- COMe-bPC2 / System Ressources 58
- 6 Connectors 59
- 7 Pinout List 60
- 7.2 Connector X1A Row A 61
- COMe-bPC2 / Pinout List 62
- 7.3 Connector X1A Row B 63
- 7.4 Connector X1B Row C 65
- 7.5 Connector X1B Row D 67
- 8 BIOS Operation 69
- 8.3 Setup Guide 70
- 8.4 BIOS Setup 72
- 8.4.2 Module Info 73
- Module Software Revisions 74
- Current LVDS Configuration 74
- Memory Module Information 75
- 8.4.3 Advanced Menu 76
- CPU Configuration 77
- IDE Configuration 78
- IDE Device Submenu 79
- AHCI Configuration 80
- AHCI PortN Submenu 81
- SuperIO Configuration 82
- Floppy Configuration Submenu 83
- ACPI Configuration 84
- ACPI Cooling Options 85
- PCIExpress Configuration 87
- USB Configuration 88
- COMe-bPC2 / BIOS Operation 89
- Hardware Health 90
- Baseboard Hardware Health 92
- Miscellaneous Settings 93
- Event Log Configuration 94
- MARS Interface Configuration 95
- Watchdog 96
- I2C Busses 97
- Remote Access Configuration 98
- Ethernet Configuration 99
- Features 100
- ME Subsystem Configuration 101
- Intel VT-d Configuration 102
- Trusted Computing 103
- 8.4.4 PCIPnP Menu 104
- 8.4.5 Boot 105
- Boot Setting Configuration 106
- 8.4.6 Security 107
- 8.4.7 Chipset 108
- North Bridge Configuration 109
- Display Control 110
- Internal LVDS Configuration 111
- Southbridge Configuration 112
- LPC Decode Range 113
- 8.4.8 Exit Menu 114
- Corporate Offices 115
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