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COM Express®
Carrier Design Guide
Guidelines for designing COM Express® Carrier Boards
December 6, 2013
Rev. 2.0
This design guide is not a specification. It contains additional detail information but does not replace
the PICMG COM Express® (COM.0) specification.
For complete guidelines on the design of COM Express® compliant Carrier Boards and systems,
refer also to the full specification – do not use this design guide as the only reference for any design
decisions. This design guide is to be used in conjunction with COM.0 R2.1.
PICMG
®
COM Express
®
Carrier Board Design Guide Rev. 2.0 / December 6, 2013
1/218
Seitenansicht 0
1 2 3 4 5 6 ... 217 218

Inhaltsverzeichnis

Seite 1 - Carrier Design Guide

COM Express®Carrier Design GuideGuidelines for designing COM Express® Carrier BoardsDecember 6, 2013Rev. 2.0This design guide is not a specification.

Seite 2

Preface1.7. Intellectual propertyThe Consortium draws attention to the fact that implementing recommendations made in this document could involve the

Seite 3 - Contents

COM Express Interfaces2.12.2. Reference SchematicsFigure 35: eDP Reference SchematicThe reference schematic provides a generic eDP interface. The eD

Seite 4

COM Express Interfaces2.13. VGA2.13.1. Signal DefinitionsThe COM Express Specification defines an analog VGA RGB interface for all Module types, exc

Seite 5

COM Express Interfaces2.13.3. VGA Reference SchematicsThis reference schematic shows a circuitry implementing a VGA port.Figure 37: VGA Reference Sch

Seite 6

COM Express Interfaces2.13.4. Routing Considerations2.13.4.1. RGB Analog SignalsThe RGB signal interface of the COM Express Module consists of three

Seite 7

COM Express Interfaces2.14. TV-OutTV-Out signals have been removed in COM.0 Rev. 2.0 and the former content of this chapter canstill be found in the

Seite 8 - 1. Preface

COM Express Interfaces2.15. Digital Audio InterfacesThe COM Express Specification allocates seven pins on the A-B connector to support digital AC’97

Seite 9 - 1.6. Name and logo usage

COM Express InterfacesFigure 38: Multiple Audio Codec ConfigurationPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013106/218CO

Seite 10 - 1.7. Intellectual property

COM Express Interfaces2.15.1. Reference Schematics2.15.1.1. High Definition AudioFigure 39: HDA Example SchematicPICMG® COM Express® Carrier Board D

Seite 11 - Term Description

COM Express Interfaces2.15.1.2. AC'97Figure 40: AC'97 Schematic ExamplePICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / Dece

Seite 12

COM Express InterfacesFigure 41: Audio AmplifierThe example above shows a traditional class AB amplifier. There are many physically smaller and more

Seite 13

Preface1.8. Acronyms, Abbreviations and Definitions UsedTable 1: Acronyms, Abbreviations and Definitions UsedTerm DescriptionAC ‘97 / HDA Audio CODEC

Seite 14

COM Express Interfaces2.15.1.3. Routing ConsiderationsThe implementation of proper component placement and routing techniques will help to ensure tha

Seite 15 - 1.10. Schematic Conventions

COM Express Interfaces2.16. LPC Bus – Low Pin Count InterfaceSince COM Express is designed to be a legacy free standard for embedded Modules, it does

Seite 16 - 2. COM Express Interfaces

COM Express InterfacesCarrier designers should not buffer LPC_CLK for maximum Module interoperability. The COM Express specification intends for a si

Seite 17 - Type 10

COM Express Interfaces2.16.2.3. LPC PLD Example – Port 80 DecoderFigure 43: LPC PLD Example – Port 80 Decoder SchematicPICMG® COM Express® Carrier Bo

Seite 18

COM Express InterfacesThe following applies to Figure 43 above.The JTAG header may be used to program the PLD in-circuit.The LPC bus is the interface

Seite 19

COM Express Interfaces2.16.2.4. SuperIOFigure 44: LPC Super I/O ExamplePICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013115/

Seite 20 - Table 4: Pin-out Comparison

COM Express InterfacesFigure 45: LPC Serial InterfacesNote: Connection between logic GND and chassis depends on grounding architecture. Connect GND w

Seite 21

COM Express InterfacesThe LPC clock implementation should follow the routing guidelines for the PCI clock defined in the COM Express specification and

Seite 22

COM Express Interfaces2.17. SPI – Serial Peripheral Interface BusThe SPI interface is defined in this specification to service as an off-module optio

Seite 23

COM Express InterfacesTable 36: Effect of the BIOS disable signalsBIOS_DIS1# BIOS_DIS0# Chipset SPI CS1# DestinationChipset SPI CS0# DestinationCarrie

Seite 24

PrefaceTerm DescriptionHDMI High Definition Multimedia InterfaceI2C Inter Integrated Circuit – 2 wire (clock and data) signaling scheme allowing commu

Seite 25

COM Express InterfacesThe optional connector J32 offers the possibility to program the flash device with an external programmer.The flash device can b

Seite 26

COM Express Interfaces2.18. General Purpose I2C Bus InterfaceThe I2C (Inter-Integrated Circuit) bus is a two-wire serial bus originally defined by Ph

Seite 27

COM Express InterfacesSpecification. The circuitry in Figure 47 below shows how to connect an Atmel 'AT24C04' 4kbit EEPROM to the General P

Seite 28

COM Express Interfaces2.19. System Management Bus (SMBus)The SMBus is primarily used as an interface to manage peripherals such as serial presence de

Seite 29

COM Express Interfaces2.19.2. Routing ConsiderationsThe SMBus should be connected to all or none of the PCIe/PCI devices and slots. A general recomm

Seite 30 - , the PCI

COM Express Interfaces2.20. General Purpose Serial InterfaceSince Revision 2.0 of the COM Express specification two optional serial ports are availab

Seite 31

COM Express Interfaces2.20.2. Reference Schematics2.20.2.1. General Purpose Serial Port ExampleFigure 49: General Purpose Serial Port Example Figure

Seite 32

COM Express Interfaces2.21. CAN InterfaceCAN bus is a vehicle bus standard designed to allow controllers and devices to communicate with each other w

Seite 33

COM Express Interfaces2.21.2. Reference Schematics2.21.2.1. CAN Bus ExampleFigure 50: CAN Bus ExampleFigure 50: CAN Bus Example shows the schematics

Seite 34 - 2.3.5. Schematic Examples

COM Express Interfaces2.22. Miscellaneous SignalsTable 42: Miscellaneous SignalsSignal Pin Description I/O CommentTYPE0#TYPE1#TYPE2#C54C57D57The Type

Seite 35

PrefaceTerm DescriptionSMBus System Management BusSO-DIMM Small Outline Dual In-line Memory ModuleSPI Serial Peripheral InterfaceTBD To be determinedT

Seite 36

COM Express Interfaces2.22.1. Module Type DetectionThe COM Express Specification includes three signals to determine the pin-out type of the Module c

Seite 37

COM Express InterfacesFigure 51: Module Type 2 Detection CircuitryPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013131/218

Seite 38

COM Express InterfacesPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013132/218

Seite 39

COM Express Interfaces2.22.2. Speaker OutputThe PC-AT architecture provides a speaker signal that creates beeps and chirps. The signal is a digital-

Seite 40

COM Express Interfaces2.22.3. RTC Battery ImplementationThe Real Time Clock (RTC) is responsible for maintaining the time and date even when the COME

Seite 41

COM Express Interfaces2.22.4. Power Management SignalsCOM Express specifies a set of signals to control the system power states such as the power-on

Seite 42

COM Express InterfacesSignal Pin Description I/O CommentSUS_S5# A24 S5 Sleep Control signal indicating that the system resides in S5 State (Soft Off).

Seite 43

COM Express Interfaces2.22.5. Watchdog TimerFigure 54: Watchdog Timer Event Latch SchematicThe Watchdog Timer (WDT) event signal is provided by the C

Seite 44

COM Express Interfaces2.22.6. General Purpose Input/Output (GPIO)Table 46: GPIO Signal DefinitionSignal Pin Description I/O CommentGPI0 A54 General p

Seite 45 - Figure 15: ExpressCard Size

COM Express InterfacesFigure 55: General Purpose I/O Loop-back SchematicThere are 4 GPI (General Purpose Inputs) and 4 GPO (General Purpose Outputs) p

Seite 46

Preface1.9. Signal Table TerminologyTable 2 below describes the terminology used in this section for the Signal Description tables. The “#” symbol a

Seite 47

COM Express Interfaces2.22.7. SDIO Interface Multiplexed with GPIOsSD Card support was added in COM.0 Rev. 2.0 as an alternative use for the GPIO pin

Seite 48 - 2.4.1. Signal Definitions

COM Express InterfacesFigure 56: SDIO Interface Multiplexed with GPIOsPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013

Seite 49 - 2.4.2. PEG Configuration

COM Express Interfaces2.22.8. Fan ConnectorFigure 57: Fan Connector Reference SchematicFAN_TACHIN and FAN_PWMOUT in Figure 57: Fan Connector Referenc

Seite 50

COM Express Interfaces2.22.9. Thermal InterfaceCOM Express provides the 'THRM#' and 'THRMTRIP#' signals, which are used for syst

Seite 51

COM Express Interfaces2.22.10. Protecting COM.0 Pins Reclaimed From the VCC_12V PoolThe COM.0 Rev. 2 Type 6 and Type 10 pin-out types introduce eight

Seite 52 - 2.4.3. Reference Schematics

COM Express InterfacesFigure 58: Protecting Logic Level Signals on Pins Reclaimed from VCC_12VPICMG® COM Express® Carrier Board Design Guide Rev. 2.0

Seite 53

COM Express Interfaces2.22.10.2. TYPE10# Strap - Reclaimed from VCC_12VNo additional protection is needed for the TYPE10# strap on the Module side:

Seite 54

COM Express Interfaces2.23. PCI Bus2.23.1. Signal DefinitionsType 2 and 3 COM Express Modules provide a 32-bit PCI bus that can operate up to 33 MHz

Seite 55 - DisplayPort is supported

COM Express InterfacesSignal Pin# Description I/O CommentPCI_STOP# D34 PCI bus STOP control line, active low I/O 3.3VPCI_PAR D32 PCI bus parity I/O 3.

Seite 56 - DisplayPort Example

COM Express InterfacesFigure 59: PCI Bus Interrupt RoutingMost of these PCI devices only utilize the interrupt signal 'INTA#'. To distribut

Seite 57 - Figure 21: HDMI Example

Preface1.10. Schematic ConventionsSchematic examples are drawn with signal directions shown per the figure below. Signals that connect directly to t

Seite 58

COM Express Interfaces2.23.2.2. Device-Down ExampleFigure 60: PCI Device Down Example; Dual UARTPICMG® COM Express® Carrier Board Design Guide Draft

Seite 59 - Figure 22: DVI Example

COM Express Interfaces2.23.2.3. Device-Down Considerations2.23.2.4. Clock BufferThe COM Express Specification only supports a single PCI clock signa

Seite 60

COM Express InterfacesThe clock trace from the COM Express Module to a PCI bus slot should be 2.5 inches shorter because PCI cards are specified to ha

Seite 61 - SDVO Port Configuration

COM Express Interfaces2.24. IDE and CompactFlash (PATA)2.24.1. Signal DefinitionsType 2 and 4 COM Express Modules provide a single channel IDE inter

Seite 62 - Supported SDVO Devices

COM Express InterfacesSignal Pin Description I/O IDE40 IDE44 CFCSEL 28 28 39N.C. 20, 32 20, 32, 44 24, 40, 51, 52, 53, 54, 55, 5639 (slave)VCC_5V 41,

Seite 63 - Read = 0111 0001 (71h)

COM Express InterfacesFigure 63: IDE 40 Pin and CompactFlash 50 Pin Connector2.24.6. Routing ConsiderationsThe IDE signals are single-ended signals w

Seite 64

Power and Reset3. Power and Reset3.1. General Power requirementsCOM Express calls for the Module to be powered by a single 12V power rail, with a +/

Seite 65

Power and Reset3.2. ATX and AT Style Power Control3.2.1. ATX vs AT SuppliesATX power supplies are in common use in contemporary PCs. ATX supplies h

Seite 66 - 2.6.1. Signal Definitions

Power and Reset3.2.3. ATX and AT Power Sequencing DiagramsA sequence diagram for an ATX style boot from a soft-off state (S5), initiated by a power b

Seite 67

Power and ResetFigure 64: ATX Style Boot – Controlled by Power ButtonPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013

Seite 68 - 3.3V, 5V and 12V are stable

COM Express Interfaces2. COM Express InterfacesThe following section summarizes the signals found on COM Express Type 10, Type 2 and Type 6 connector

Seite 69

Power and ResetFigure 65: AT Style Power Up BootTable 53 below indicates roughly what time ranges can be expected during the boot process, per Figure

Seite 70 - 2.7. LAN

Power and ResetTable 53: ATX and AT Power Up Timing ValuesParameter Min ValueMax ValueDescription CommentsTPB 10ms 500ms Push Button Power Switch – ti

Seite 71

Power and Reset3.2.5. Power ButtonThe COM Express PWRBTN# input may be used by Carrier Board hardware to implement ATX style power control. A schema

Seite 72

Power and Reset3.3. Design Considerations for Carrier Boards containing FPGAs/CPLDsVery often, the Carrier Board will contain custom FPGA or other pr

Seite 73 - 2.7.2. Reference Schematics

Power and Reset3.4. Reference Schematics3.4.1. ATX Power SupplyATX power supplies are used in millions of desktop PCs and are often used in OEM equi

Seite 74

Power and ResetFigure 66: AT and ATX Power SupplyPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013 165/218

Seite 75

Power and ResetThe PWRBTN# signal is an input to the COM Express Module. Switch de-bouncing is done on the Module. The falling edge of the PWRBTN# s

Seite 76 - 2.8. USB Ports

Power and Reset3.5. Routing Considerations3.5.1. VCC_12V and GNDThe primary consideration for the +12V power input (VCC_12V) to the Module is that t

Seite 77 - 2.8.2. Reference Schematics

Power and ResetTable 56: Approximate Copper Trace Current Capability per IPC-2221 ChartsTrace Type Max Current with 10°C Temp Rise Max Current with 20

Seite 78

Power and Reset3.5.5. Slot Card Supply Decoupling RecommendationsImplementing PCI Express connectors on the Carrier Board requires decoupling of the

Seite 79

COM Express InterfacesFigure 2: COM Express Type 10 Connector LayoutPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 201317/218C

Seite 80

BIOS Considerations4. BIOS Considerations4.1. Legacy versus Legacy-FreeFor the purposes of this document, “legacy” refers to a set of peripherals pr

Seite 81 - 2.9. USB 3.0

COM Express Module Connectors5. COM Express Module Connectors5.1. Connector DescriptionsA pair of 220-pin COM Express Carrier-Board connectors is av

Seite 82

COM Express Module Connectorspeg location holes in the PCB connector pattern are in the correct positions (as shown in the landpattern of the COM Expr

Seite 83 - 2.9.1.3. USB 3.0 connector

Carrier Board PCB Layout Guidelines6. Carrier Board PCB Layout Guidelines6.1. General6.2. PCB Stack-upsNote Section 6 'Carrier Board PCB Layou

Seite 84 - 2.9.2. Reference Schematics

Carrier Board PCB Layout GuidelinesFigure 69 above is an example of a six layer stack-up. Layers L1, L3, L4 and L6 are used for signal-routing. Laye

Seite 85

Carrier Board PCB Layout Guidelines6.3. Trace-Impedance ConsiderationsMost high-speed interfaces used in an COM Express design for a Carrier Board ar

Seite 86

Carrier Board PCB Layout GuidelinesFigure 71: Microstrip Cross SectionFigure 72: Strip Line Cross SectionTable 60: Trace ParametersSymbol Definitionεr

Seite 87 - 2.10. SATA

Carrier Board PCB Layout Guidelines6.4. Trace-Length Extensions ConsiderationsHigh speed differential signals need controlled impedance and according

Seite 88 - Pins Signal Description

Carrier Board PCB Layout Guidelines6.5. Routing Rules for High-Speed Differential InterfacesThe following is a list of suggestions for designing with

Seite 89 - SATA Port

Carrier Board PCB Layout GuidelinesFigure 74: Layout ConsiderationsPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013179/218

Seite 90

COM Express InterfacesFigure 3: COM Express Type 2 Connector LayoutPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 201318/218PAT

Seite 91 - 2.11. LVDS

Carrier Board PCB Layout GuidelinesPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013180/218

Seite 92

Carrier Board PCB Layout GuidelinesIn order to determine the necessary trace width, trace height and spacing needed to fulfill the requirements of the

Seite 93

Carrier Board PCB Layout Guidelines6.5.1. PCI Express Trace Routing GuidelinesTable 61: PCI Express Trace Routing GuidelinesParameter PCIe Gen1 PCIe

Seite 94 - Term Definition

Carrier Board PCB Layout Guidelines6.5.2. USB Trace Routing GuidelinesTable 62: USB Trace Routing GuidelinesParameter Trace RoutingTransfer rate / Po

Seite 95

Carrier Board PCB Layout Guidelines6.5.3. USB 3.0 Trace Routing GuidelinesTable 63: USB 3.0 Trace Routing GuidelinesParameter Trace RoutingTransfer r

Seite 96

Carrier Board PCB Layout Guidelines6.5.5. SDVO Trace Routing GuidelinesTable 64: SDVO Trace Routing GuidelinesParameter Trace RoutingTransfer Rate /

Seite 97 - 2.11.2. Reference Schematics

Carrier Board PCB Layout Guidelines6.5.6. DisplayPort Trace Routing GuidelinesTable 65: DisplayPort Trace Routing GuidelinesParameter Trace RoutingTr

Seite 98

Carrier Board PCB Layout Guidelines6.5.7. LAN Trace Routing GuidelinesTable 66: LAN Trace Routing GuidelinesParameter Trace RoutingSignal length allo

Seite 99 - 2.12.1. Signal Definitions

Carrier Board PCB Layout Guidelines6.5.8. Serial ATA Trace Routing GuidelinesTable 67: Serial ATA Trace Routing GuidelinesParameter Trace RoutingTran

Seite 100 - 2.12.2. Reference Schematics

Carrier Board PCB Layout Guidelines6.5.9. LVDS Trace Routing GuidelinesTable 68: LVDS Trace Routing GuidelinesParameter Trace RoutingMaximum signal l

Seite 101 - 2.13. VGA

COM Express InterfacesFigure 4: COM Express Type 6 Connector LayoutPICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 201319/218M o

Seite 102 - COM Express Interfaces

Carrier Board PCB Layout Guidelines6.6. Routing Rules for Single Ended InterfacesThe following is a list of suggestions for designing with single end

Seite 103

Carrier Board PCB Layout Guidelines6.6.1. PCI Trace Routing GuidelinesTable 69: PCI Trace Routing GuidelinesParameter Trace RoutingTransfer Rate @ 33

Seite 104 - 2.14. TV-Out

Carrier Board PCB Layout Guidelines6.6.2. IDE Trace Routing GuidelinesTable 70: IDE Trace Routing GuidelinesParameter Trace RoutingMaximum Transfer R

Seite 105

Carrier Board PCB Layout Guidelines6.6.3. LPC Trace Routing GuidelinesTable 71: LPC Trace Routing GuidelinesParameter Trace RoutingTransfer Rate @ 33

Seite 106 - COM Express Module

Mechanical Considerations7. Mechanical Considerations7.1. Form FactorsThe COM Express specification describes 4 different sized COM Express Modules.

Seite 107 - ANALOG I/O CONNECTOR

Mechanical Considerations7.2. HeatspreaderAn important factor for each system integration is the thermal design. The heatspreader acts as a thermal

Seite 108 - 2.15.1.2. AC'97

Mechanical Considerations7.2.1. Top mountingFor top mounting heatspreaders with non-threaded standoffs (bore hole) are used.This variant of the heats

Seite 109 - Figure 41: Audio Amplifier

Mechanical Considerations7.2.2. Bottom mountingHeatspreaders with threaded standoffs are used for bottom-mounting solutions.This variant of the heats

Seite 110

Mechanical ConsiderationsTable 72: Heatspreader mounting material needed (5mm connectors at the Carrier Board)Component Quantity CommentM2.5 x 16mm sc

Seite 111 - 2.16.1. Signal Definition

Applicable Documents and Standards8. Applicable Documents and Standards8.1. Technology SpecificationsTable 75: Reference specificationsSpecification

Seite 112

© Copyright 2013, PCI Industrial Computer Manufacturers Group. The attention of adopters is directed to the possibility that compliance with or adopt

Seite 113

COM Express Interfaces2.1.1. Connector Pin-out ComparisonTable 4: Pin-out ComparisonPin# Type 10 Description Type 2 Description Type 6 DescriptionA1

Seite 114

Applicable Documents and StandardsSpecification Description LinkPCI Express Mobile Graphics Low-Power Addendum to the PCI Express Base Specificationww

Seite 115 - SUPER I/O

Applicable Documents and Standards8.2. Regulatory SpecificationsFCC Rules Part 15 Class B devicesEN 61000-4-2 Personnel Electrostatic Discharge Immun

Seite 116 - COM1/COM2

Applicable Documents and Standards8.3. Useful booksTable 76: Useful booksTitle Author NotePCI Express System Architecture Ravi Budruk, Don Anderson,

Seite 117

Appendix A: Deprecated Features9. Appendix A: Deprecated FeaturesThe following content was removed from the main part of this document because it is

Seite 118 - 2.17.1. Signal Definition

Appendix A: Deprecated FeaturesTable 78: TV-Out Connector Pin-outPin Signal Description Pin Signal Description1 Chrominance (C) S-Video Chrominance An

Seite 119

Appendix A: Deprecated Features9.1.3. TV-Out Reference SchematicsAll signals along the left edge of the figure below are sourced directly from the CO

Seite 120

Appendix A: Deprecated Features9.1.4. Routing ConsiderationsAt least 30mils of spacing should be used for the routing between each TV-DAC channel to

Seite 121 - 2.18.2. Reference Schematics

Appendix A: Deprecated Features9.2. LPC Firmware HubAn example of a Carrier Board Firmware Hub (FWH) implementation is shown in Figure 80: LPC Firmwa

Seite 122

Appendix A: Deprecated FeaturesThe BIOS device shown in Figure 80: LPC Firmware Hub above is a SST SST49LF008A Firmware Hub in a 32-pin PLCC package.

Seite 123 - 2.19.1. Signal Definitions

Appendix B: Sourcecode for Port 80 Decoder10. Appendix B: Sourcecode for Port 80 Decoder-- IO80 catcher for LPC bus.-- File: LPC_IOW80_1.1.VHD-- Rev

Seite 124

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionA44 USB_2_3_OC# USB_2_3_OC# USB_2_3_OC# A45 USB0- USB0-

Seite 125 - 2.20.1. Signal Definitions

Appendix B: Sourcecode for Port 80 Decoder----------------------------------------------------------------------------- LPC state machine-- LPC_State

Seite 126 - C O M 1 C O M 2

Appendix B: Sourcecode for Port 80 DecoderLPC_State <= IDLE; -- abort cycle, bad frame -- or address mismatchelse-- Write address valid. Subseq

Seite 127 - 2.21. CAN Interface

Appendix B: Sourcecode for Port 80 Decoderwhen "0111" => seven_seg_H <= "00011111"; -- Hex 1f displays a 7when "1000&

Seite 128 - 2.21.2. Reference Schematics

Appendix C: List of Tables11. Appendix C: List of TablesTable 1: Acronyms, Abbreviations and Definitions Used...

Seite 129 - 2.22. Miscellaneous Signals

Appendix C: List of TablesTable 45: Power Management Signal Descriptions...

Seite 130

Appendix D: List of Figures12. Appendix D: List of FiguresFigure 1: Schematic Conventions...

Seite 131

Appendix D: List of FiguresFigure 48: System Management Bus Separation...

Seite 132

Appendix E: Revision History13. Appendix E: Revision HistoryTable 79: Revision HistoryRevision Date Author Changes1.00 RC1.0 Jan 16, 2009 C. Eder1.10

Seite 133 - Type 2 Detection

Appendix E: Revision HistoryAdded Note for later updated PCI Gen 3.0 Layout Rules2.0 beta 0.7 April, 9, 2013 M. Unverdorben Implementation of COM_CRs_

Seite 134

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionA90 GND(FIXED) GND(FIXED) GND(FIXED) A91 SPI_POWER SPI

Seite 135

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionB26 USB_SSTX1+ SATA3_RX- SATA3_RX- B27 WDT WDT WDT B

Seite 136

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionB72 DDI0_PAIR0- LVDS_B0- LVDS_B0- B73 DDI0_PAIR1+ LVDS_B1

Seite 137 - 2.22.5. Watchdog Timer

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionC8 - IDE_D2 GND C9 - IDE_D13 USB_SSRX2- C10 - IDE_D1

Seite 138

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionC54 - TYPE0# TYPE0# C55 - PEG_RX1+ PEG_RX1+ C56 - PEG_R

Seite 139

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionC100 - GND(FIXED) GND(FIXED) C101 - PEG_RX15+ PEG_RX15+

Seite 140

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionD36 - PCI_FRAME# DDI1_PAIR3+ D37 - PCI_AD16 DDI1_PAIR3- D

Seite 141 - G P IO C o n n e c t o r

COM Express InterfacesPin# Type 10 Description Type 2 Description Type 6 DescriptionD82 - PEG_TX9- PEG_TX9- D83 - RSVD RSVDD84 - GND GND D85

Seite 143 - 2.22.9. Thermal Interface

COM Express Interfaces2.2. PCIe General IntroductionPCI Express provides a scalable, high-speed, serial I/O point-to-point bus connection. A PCI Exp

Seite 144

COM Express Interfaces2.3. General Purpose PCIe Lanes2.3.1. General Purpose PCIe Signal DefinitionsThe general purpose PCI Express interface of the

Seite 145

COM Express InterfacesSignal Pin# Description I/O CommentSYS_RESET# input, a low PWR_OK input, a VCC_12V power input that falls below the minimum spec

Seite 146

COM Express Interfaces2.3.4. Device Up / Device Down and PCIe Rx / Tx Coupling CapacitorsFigure 5: PCIe Rx Coupling Capacitors“Device Down” refers to

Seite 147 - 2.23. PCI Bus

COM Express Interfaces2.3.5. Schematic Examples2.3.5.1. Reference Clock BufferThe COM Express Specification calls for one copy of the PCIe reference

Seite 148 - 2.23.2. Reference Schematics

COM Express InterfacesFigure 6: PCIe Reference Clock BufferThe following notes apply to Figure 6 'PCIe Reference Clock Buffer'.Nets that tie

Seite 149

COM Express InterfacesEach clock output pair in the example shown is terminated close to the IDT9DB433 buffer pins with a series resistor (shown as 33

Seite 150

COM Express Interfaces2.3.5.2. ResetThe PCI Interface of the COM Express Type 2 Module shares the reset signal 'PCI_RESET#' with the PCI Ex

Seite 151

COM Express Interfacespin will be read high. Software then uses this information to apply power to the card. There is nostandard input port pin defi

Seite 152

COM Express Interfaces2.3.5.5. PCIe x1 Generic Device Down ExampleFigure 9: PCI Express x1 Generic Device Down ExampleA generic example of a PCIe x1

Seite 153 - 2.24.1. Signal Definitions

2.8.4. Routing Considerations...802.9. USB 3.0...

Seite 154

COM Express Interfaces2.3.5.6. PCIe x4 Generic Device Down ExampleFigure 10: PCI Express x4 Generic Device Down ExampleA generic example of a PCIe x4

Seite 155

COM Express InterfacesPCI Express Mini Cards are popular for implementing features such as wireless LAN. A small footprint connector can be implement

Seite 156 - 3. Power and Reset

COM Express InterfacesFigure 13: PCI Express Mini Card Connector on COM Express Carrier BoardThe different card sized can be easily handled on the Car

Seite 157 - 3.2.2. Power States

COM Express InterfacesTable 7: PCIe Mini Card Connector Pin-outPin Signal Description Pin Signal Description1 WAKE# Requests the host interface to ret

Seite 158 - Power and Reset

COM Express InterfacesFigure 14: PCIe Mini Card Reference CircuitryA PCI Express Mini Card schematic example is shown in Figure 14 above. The referen

Seite 159

COM Express InterfacesTable 8: Support Signals for ExpressCardSignal Pin Description I/OEXCD0_CPPE# A49 ExpressCard capable card request, slot 0. I 3.

Seite 160

COM Express InterfacesFigure 17: PCI Express: ExpressCard ExampleFigure 17 above shows an ExpressCard implementation. The example shows COM Express P

Seite 161

COM Express InterfacesThe TPS2231 includes a number of integrated pull-up resistors. Other solutions may require external pull-ups not shown in this

Seite 162 - 3.2.5. Power Button

COM Express Interfaces2.4. PEG (PCI Express Graphics)2.4.1. Signal DefinitionsThe PEG Port can utilize COM Express PCIe lanes 16-31 and is suitable

Seite 163

COM Express InterfacesSignal Pin# Description I/O CommentPEG_TX9+PEG_TX9-D81D82PEG channel 9, Transmit Output differential pair.O PCIEPEG_RX10+PEG_RX1

Seite 164 - 3.4. Reference Schematics

2.21.1. Signal Definitions...1272.21.2. Refe

Seite 165

COM Express Interfaces2.4.2.1. Using PEG Pins for an External Graphics CardTo use the COM Express PEG lanes for an external graphics device or card,

Seite 166 - ATX Signal Name Description

COM Express InterfacesModules that employ desktop and mobile chip-sets with PEG capability can usually be set up to allow the COM Express PEG lanes to

Seite 167 - 3.5. Routing Considerations

COM Express Interfaces2.4.3. Reference Schematics2.4.3.1. x1, x4, x8, x16 SlotFigure 18 below illustrates the pin-out definition for the standard x1

Seite 168 - 3.5.3. VCC5_SBY Routing

COM Express InterfacesThe x16 connector usually is used to drive the PCI Express Graphics Port (PEG) consisting of 16PEG lanes, which are connected to

Seite 169

COM Express InterfacesFigure 19: PEG Lane Reversal ModeTo activate the Lane Reversal mode for the PEG Port, the COM Express specification defines an a

Seite 170 - 4. BIOS Considerations

COM Express Interfaces2.5. Digital Display InterfacesModule Types 6 and 10 use Digital Display Interfaces (DDI) to provide DisplayPort, HDMI/DVI, and

Seite 171 - Type Height Partnumber Note

COM Express Interfaces2.5.1.2. Reference SchematicDisplayPort ExampleFigure 20: DisplayPort Reference SchematicsDisplayPort is directly supported by

Seite 172 - COM Express Module Connectors

COM Express InterfacesHDMI ExampleFigure 21: HDMI ExamplePICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013 57/218use wi

Seite 173 - Power Plane

COM Express InterfacesA Dual-mode source Module requires level shifters on the Carrier to convert the low-swing AC coupled differential pairs from the

Seite 174

COM Express InterfacesDVI ExampleFigure 22: DVI ExamplePICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013 59/218SHIELD_G

Seite 175 - COM Express

4.2. Super I/O... 1685. COM

Seite 176 - Symbol Definition

COM Express InterfacesA Dual-mode source Module requires level shifters on the Carrier to convert the low-swing AC coupled differential pairs from the

Seite 177

COM Express Interfaces2.5.2. SDVOSDVO was developed by the Intel® Corporation to interface third party SDVO compliant display controller devices that

Seite 178 - Carrier Board

COM Express InterfacesSupported SDVO DevicesDue to the fact that SDVO is an Intel® defined interface, the number of supported SDVO devices is limited

Seite 179

COM Express Interfaces2.5.2.2. Reference SchematicsSDVO to DVI Transmitter ExampleFigure 23: SDVO to DVI Transmitter ExampleFigure 23 'SDVO to D

Seite 180

COM Express InterfacesPEG_RX1+ and PEG_RX1- are sourced from COM Express Module pins C55 and C56 and are defined as SDVOB_INT+ and SDVOB_INT- in the C

Seite 181

COM Express InterfacesThe Digital Video Interface (DVI) is based on the differential signaling method TDMS. To achievethe full performance and reliab

Seite 182

COM Express Interfaces2.6. Mobile PCI Express Module (MXM)Mobile PCI Express Module is an interconnect standard for GPUs defined by the MXM-SIG, main

Seite 183 - Parameter Trace Routing

COM Express InterfacesThe MXM3 Module shown in this example supports two DisplayPort channels. They are designated DP1 and DP3 on the schematic. The

Seite 184

COM Express Interfaces2.6.2. Reference SchematicsFigure 24: MXM Reference SchematicsPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / D

Seite 185

COM Express InterfacesFigure 25: DisplayPort implementation of MXM interface (one channel)Following notes apply to Figure 24: MXM Reference Schematics

Seite 186

9.1.4. Routing Considerations...2029.1.5. Signal Termi

Seite 187

COM Express Interfaces2.7. LANAll COM Express Modules provide at least one LAN port. The 8-wire 10/100/1000BASE-T Gigabit Ethernet interface complia

Seite 188

COM Express InterfacesTable 17: LAN Interface LED FunctionLED-Function LED Color# LED State DescriptionLink Speed Green / Orange Off 10 Mbps link spee

Seite 189

COM Express InterfacesAs there are a large number of Ethernet PHY components and coupling transformers on the market, it is strongly recommended that

Seite 190

COM Express Interfaces2.7.2. Reference Schematics2.7.2.1. Magnetics Integrated Into RJ-45 ReceptacleFigure 26: Magnetics Integrated Into RJ-45 Recep

Seite 191

COM Express Interfaces2.7.2.2. Discrete Coupling TransformerFigure 27: Discrete Coupling TransformerPICMG® COM Express® Carrier Board Design Guide Re

Seite 192

COM Express Interfaces2.7.3. Routing ConsiderationsThe 8-wire PHY / MDI circuit is required to meet a specific waveform template and associated signa

Seite 193

COM Express Interfaces2.8. USB PortsA COM Express Module must support a minimum of 4 USB Ports and can support up to 8 USB Ports. All of the USB Por

Seite 194 - Extended

COM Express InterfacesTable 18: USB Signal DescriptionSignal Pin#Description I/O CommentUSB0+ A46 USB Port 0, data + or D+ I/O USB mandatory on Module

Seite 195 - 7.2. Heatspreader

COM Express InterfacesThe first schematic is powered from VCC_5V_SBY Suspend power and can provide Wake on LAN support. The second schematic is power

Seite 196 - (M2.5 thread)

COM Express InterfacesFigure 29: USB Reference DesignPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 / December 6, 2013 79/218USBP2J_EMI

Seite 197 - (Ø2.7 bore hole)

Preface1. Preface1.1. About This DocumentThis document provides information for designing a custom system Carrier Board for COM Express Modules. It

Seite 198 - Mechanical Considerations

COM Express Interfaces2.8.3. Avoiding Back-driving ProblemsFor more information please refer to chapter 2.9.3 'Avoiding Back-driving Problems&ap

Seite 199

COM Express Interfaces2.9. USB 3.0USB 3.0 is the third major revision of the Universal Serial Bus (USB) standard for computer connectivity. It adds

Seite 200

COM Express InterfacesSignal Pins T6 Pins T10 Description I/OUSB_SSRX3+ C13 USB Port 3, SuperSpeed RX + I PCIEUSB_SSRX3- C12 USB Port 3, SuperSpeed RX

Seite 201

COM Express Interfaces2.9.1.3. USB 3.0 connectorFigure 30: USB 3.0 ConnectorTable 23: USB 3.0 Connector Signal DescriptionSignal Pin Description I/O

Seite 202 - 8.3. Useful books

COM Express Interfaces2.9.2. Reference Schematics2.9.2.1. USB 3.0 ExampleFigure 31: USB 3.0 Example SchematicJ5 incorporates a dual USB 3.0 Type A h

Seite 203 - 9.1. TV-Out

COM Express InterfacesESD protection diodes D7 through D12 provide overvoltage protection caused by ESD and electrical fast transients . Low capacita

Seite 204

COM Express Interfaces2.9.3. Avoiding Back-driving ProblemsFigure 32: Avoiding Back-drivingBack driving of power from a USB device to power rails on

Seite 205

COM Express Interfaces2.10. SATASupport for up to four SATA ports is defined on the COM Express A-B connector. Support for a minimum of two ports is

Seite 206 - 9.1.7. ESD Protection

COM Express InterfacesTable 26: Serial ATA Power Connector Pin-outPins Signal Description1,2,3 +3.3V 3.3V power supply4,5,6 GND Ground7,8,9 +5V 5V pow

Seite 207 - 9.2. LPC Firmware Hub

COM Express Interfaces2.10.2. Reference SchematicFigure 33: SATA Connector DiagramThe following notes apply to Figure 33 above.The Module provides a

Seite 208

Preface1.6. Name and logo usageThe PCI Industrial Computer Manufacturers Group’s policies regarding the use of its logos and trademarks are as follow

Seite 209

COM Express Interfaces2.10.3. Routing ConsiderationsRoute SATA signals as differential pairs, with a 85 Ω differential impedance and a 50 Ω, single-e

Seite 210

COM Express Interfaces2.11. LVDS2.11.1. Signal DefinitionsThe COM Express Specification provides an optional LVDS interface on the COM Express A-B c

Seite 211

COM Express Interfaces2.11.1.1. Connector and Cable ConsiderationsWhen implementing LVDS signal pairs on a single-ended Carrier Board connector, the

Seite 212

COM Express Interfaces2.11.1.4. Color Mapping and TermsFPD-Link and Open LDI Color MappingAn LVDS stream consists of frames that pack seven data bits

Seite 213 - Appendix C: List of Tables

COM Express InterfacesTable 28: LVDS Display Terms and DefinitionsTerm DefinitionColor-MappingColor-mapping refers to the order in which display color

Seite 214

COM Express InterfacesThe Open LDI specification uses the term “pixel clock” differently from most other documents. In the Open LDI specification, th

Seite 215 - Appendix D: List of Figures

COM Express InterfacesTable 30: LVDS Display: Dual Channel, Unbalanced Color-MappingXmit Bit OrderLVDSClockOpen LDI18 bit (36 bit)Dual ChOpen LDI24 bi

Seite 216

COM Express Interfaces2.11.2. Reference SchematicsFigure 34: LVDS Reference SchematicPICMG® COM Express® Carrier Board Design Guide Draft Rev. 2.0 /

Seite 217 - Revision Date Author Changes

COM Express Interfaces2.11.3. Routing ConsiderationsRoute LVDS signals as differential pairs (excluding the five single-ended support signals), with

Seite 218

COM Express Interfaces2.12. Embedded DisplayPort (eDP)Embedded DisplayPort (eDP) is a digital display interface standard produced by the Video Electr

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