Kontron COMe Starterkit Eval T2 Bedienungsanleitung Seite 6
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4.2. Super I/O............................................................................................................................ 168
5. COM Express Module Connectors.................................................................................169
5.1. Connector Descriptions....................................................................................................169
5.2. Connector Land Patterns and Alignment........................................................................169
5.3. Connector and Module CAD Symbol Recommendations..............................................170
6. Carrier Board PCB Layout Guidelines...........................................................................171
6.1. General............................................................................................................................... 171
6.2. PCB Stack-ups.................................................................................................................. 171
6.2.1. Four-Layer Stack-up......................................................................................................171
6.2.2. Six-Layer Stack-up........................................................................................................171
6.2.3. Eight-Layer Stack-up.....................................................................................................172
6.3. Trace-Impedance Considerations....................................................................................173
6.4. Trace-Length Extensions Considerations.......................................................................175
6.5. Routing Rules for High-Speed Differential Interfaces....................................................176
6.5.1. PCI Express Trace Routing Guidelines.........................................................................178
6.5.2. USB Trace Routing Guidelines......................................................................................179
6.5.3. USB 3.0 Trace Routing Guidelines................................................................................180
6.5.4. PEG Trace Routing Guidelines......................................................................................180
6.5.5. SDVO Trace Routing Guidelines...................................................................................181
6.5.6. DisplayPort Trace Routing Guidelines...........................................................................182
6.5.7. LAN Trace Routing Guidelines......................................................................................183
6.5.8. Serial ATA Trace Routing Guidelines.............................................................................184
6.5.9. LVDS Trace Routing Guidelines....................................................................................185
6.6. Routing Rules for Single Ended Interfaces.....................................................................186
6.6.1. PCI Trace Routing Guidelines.......................................................................................187
6.6.2. IDE Trace Routing Guidelines.......................................................................................188
6.6.3. LPC Trace Routing Guidelines......................................................................................189
7. Mechanical Considerations............................................................................................190
7.1. Form Factors..................................................................................................................... 190
7.2. Heatspreader..................................................................................................................... 191
7.2.1. Top mounting.................................................................................................................192
7.2.2. Bottom mounting............................................................................................................193
7.2.3. Materials........................................................................................................................193
8. Applicable Documents and Standards..........................................................................195
8.1. Technology Specifications...............................................................................................195
8.2. Regulatory Specifications................................................................................................197
8.3. Useful books...................................................................................................................... 198
9. Appendix A: Deprecated Features.................................................................................199
9.1. TV-Out................................................................................................................................ 199
9.1.1. Signal Definitions...........................................................................................................199
9.1.2. TV-Out Connector..........................................................................................................199
9.1.3. TV-Out Reference Schematics......................................................................................201
PICMG
®
COM Express
®
Carrier Board Design Guide Rev. 2.0 / December 6, 2013
6/218
- COM Express® 1
- Carrier Design Guide 1
- Contents 3
- 1. Preface 8
- 1.6. Name and logo usage 9
- 1.7. Intellectual property 10
- Term Description 11
- 1.10. Schematic Conventions 15
- 2. COM Express Interfaces 16
- COM Expre ss Module 17
- Type 10 17
- Table 4: Pin-out Comparison 20
- , the PCI 30
- 2.3.5. Schematic Examples 34
- Signal Pin Description I/O 45
- Figure 15: ExpressCard Size 45
- 2.4.1. Signal Definitions 48
- 2.4.2. PEG Configuration 49
- 2.4.3. Reference Schematics 52
- DisplayPort is supported 55
- DisplayPort Example 56
- Figure 21: HDMI Example 57
- Figure 22: DVI Example 59
- SDVO Port Configuration 61
- Supported SDVO Devices 62
- DVI_SDAROM 63
- DVI_SCLROM 63
- SDVO I2C Bus Address 63
- Write = 0111 0000 (70h) 63
- Read = 0111 0001 (71h) 63
- 2.6.1. Signal Definitions 66
- Earliest asserted 1ms after 68
- 3.3V, 5V and 12V are stable 68
- 2.7. LAN 70
- 2.7.2. Reference Schematics 73
- 2.8. USB Ports 76
- 2.8.2. Reference Schematics 77
- 2.9. USB 3.0 81
- 2.9.1.3. USB 3.0 connector 83
- 2.9.2. Reference Schematics 84
- 2.10. SATA 87
- Pins Signal Description 88
- SATA Port 89
- 2.11. LVDS 91
- Term Definition 94
- 2.11.2. Reference Schematics 97
- 2.12.1. Signal Definitions 99
- 2.12.2. Reference Schematics 100
- 2.13. VGA 101
- COM Express Interfaces 102
- 2.14. TV-Out 104
- COM Express Module 106
- AUDIO POWER 107
- AUDIO CODEC - ALC888 107
- ANALOG I/O CONNECTOR 107
- 2.15.1.2. AC'97 108
- Figure 41: Audio Amplifier 109
- 2.16.1. Signal Definition 111
- SUPER I/O 115
- COM1/COM2 116
- 2.17.1. Signal Definition 118
- 2.18.1. Signal Definitions 121
- 2.18.2. Reference Schematics 121
- 2.19.1. Signal Definitions 123
- 2.20.1. Signal Definitions 125
- C O M 1 C O M 2 126
- 2.21. CAN Interface 127
- 2.21.2. Reference Schematics 128
- 2.22. Miscellaneous Signals 129
- POWER ATX 133
- POWER AT 133
- Type 2 Detection 133
- 2.22.5. Watchdog Timer 137
- G P IO C o n n e c t o r 141
- 2.22.8. Fan Connector 142
- 2.22.9. Thermal Interface 143
- 2.23. PCI Bus 147
- 2.23.2. Reference Schematics 148
- 2.24.1. Signal Definitions 153
- 3. Power and Reset 156
- 3.2.1. ATX vs AT Supplies 157
- 3.2.2. Power States 157
- Power and Reset 158
- 3.2.5. Power Button 162
- 3.4. Reference Schematics 164
- Table 55: ATX Signal Names 166
- ATX Signal Name Description 166
- 3.5. Routing Considerations 167
- 3.5.3. VCC5_SBY Routing 168
- 4. BIOS Considerations 170
- Type Height Partnumber Note 171
- COM Express Module Connectors 172
- GND Plane 173
- Power Plane 173
- COM Express 175
- Table 60: Trace Parameters 176
- Symbol Definition 176
- Carrier Board 178
- Parameter Trace Routing 183
- Extended 194
- 7.2. Heatspreader 195
- (Ø2.7mm bore hole) 196
- (M2.5 thread) 196
- (Ø2.7 bore hole) 197
- Mechanical Considerations 198
- 8.3. Useful books 202
- 9.1. TV-Out 203
- 9.1.5. Signal Termination 206
- 9.1.6. Video Filter 206
- 9.1.7. ESD Protection 206
- 9.2. LPC Firmware Hub 207
- Appendix C: List of Tables 213
- Appendix D: List of Figures 215
- Table 79: Revision History 217
- Revision Date Author Changes 217
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