Preface AM4022
Page vi ID 1052-0183, Rev. 1.0
5. Power Considerations ............................................................. 5 - 3
5.1 AM4022 Voltage Ranges .........................................................................5 - 3
5.2 Carrier Power Requirements ...................................................................5 - 3
5.2.1 Module Management Power ...........................................................5 - 3
5.2.2 Payload Power ................................................................................5 - 3
5.2.3 Payload and MMC Voltage Ramp ...................................................5 - 4
5.2.4 Power Sequencing for Unmanaged Systems .................................5 - 4
5.3 Payload Power Consumption ..................................................................5 - 4
5.3.1 Payload Power Consumption with COM Port on Front I/O .............5 - 6
5.3.2 Payload Power Consumption with DP on Front I/O ........................5 - 6
5.4 Payload Power Consumption of Accessories ..........................................5 - 7
5.5 IPMI FRU Payload Power Consumption ..................................................5 - 7
6. Thermal Considerations ......................................................... 6 - 3
6.1 Board Thermal Monitoring .......................................................................6 - 3
6.2 Processor Thermal Monitoring .................................................................6 - 3
6.2.1 Digital Thermal Sensor (DTS) .........................................................6 - 3
6.2.2 Adaptive Thermal Monitor ...............................................................6 - 3
6.2.3 Frequency/VID Control ...................................................................6 - 4
6.2.4 Clock Modulation .............................................................................6 - 5
6.2.5 Catastrophic Cooling Failure Sensor ..............................................6 - 5
6.3 Chipset Thermal Monitor Feature ............................................................6 - 5
6.4 System Airflow .........................................................................................6 - 6
6.4.1 Thermal Characteristic Diagrams for the AM4022 ..........................6 - 8
6.4.2 Airflow Impedance .........................................................................6 - 10
6.4.3 Airflow Paths .................................................................................6 - 11
A. SATA Flash Module ................................................................ A - 3
A.1 Technical Specifications ......................................................................... A - 3
A.2 SATA Flash Module Layout .................................................................... A - 4
(92 Seiten)
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